http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006008884-A
Outgoing Links
Predicate | Object |
---|---|
assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_20d3042eb4ea7c9afd525aa89373349d |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-40 |
filingDate | 2004-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b280d12b47fcbcbafa354dd7a30f84c |
publicationDate | 2006-01-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2006008884-A |
titleOfInvention | Epoxy resin composition and cured product thereof |
abstract | PROBLEM TO BE SOLVED: To provide an epoxy resin composition capable of solving the above problems and a cured product obtained by curing the same, by developing a curing agent having excellent fluidity and capable of imparting good dielectric properties to the cured product. . The following general formula (1) [Chemical 1] (In the formula, Ar 1 and Ar 2 represent an aromatic ring which may have a substituent, and R 1 and R 2 represent an alkyl group.) The epoxy resin composition characterized by containing the bivalent silyl ether compound (a) represented by these, and an epoxy resin (b), and the hardened | cured material which hardened this. [Selection figure] None |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114605644-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-114605644-B |
priorityDate | 2004-06-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 102.