http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003050462-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_dbdfa36b677f4ef61245ca725011e221 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-09 |
| filingDate | 2001-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71b51c84600c26d6d0be5f371161d05a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e2825efdae08cc097278baa10495b80 |
| publicationDate | 2003-02-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2003050462-A |
| titleOfInvention | Photosensitive resin laminate |
| abstract | PROBLEM TO BE SOLVED: To have a high resolution and to reduce defects such as defects in a resist pattern and defects such as chipping, disconnection, and short-circuit of a circuit formed in an etching step or a plating step. Provided is a photosensitive resin laminate in which a peeling residue is less likely to occur in a resist pattern peeling step after electrolytic plating by a semi-additive method. SOLUTION: In a photosensitive resin laminate comprising a support layer (A), a photosensitive resin layer (B) and an optional protective layer (C), the diameter of the support layer (A) is 10 μm. m or more, 10/9 metal-containing particles or aggregates thereof cm 2 or less, and the thickness of the photosensitive resin layer (B) is 5 to 30 μm. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016042170-A |
| priorityDate | 2001-08-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 196.