| abstract |
PROBLEM TO BE SOLVED: To provide a positive resist film having excellent sensitivity, developability, excellent residual film ratio, and excellent heat resistance, chemical resistance, adhesion to a substrate, and transparency in a visible light region. To provide a radiation-sensitive resin composition that can be formed. SOLUTION: The positive radiation-sensitive resin composition contains an alkali-soluble unsaturated resin, a quinonediazide compound, and a crosslinking agent having a functional group capable of forming a crosslink between the alkali-soluble unsaturated resins. The alkali-soluble unsaturated resin used in this composition is an epoxy compound represented by the following general formula (1): (Wherein each R is independently a hydrogen atom, Represents a straight-chain or branched alkyl group, a phenyl group, or a halogen atom. ) And (meth) acrylic acid and at least one polybasic carboxylic acid or an anhydride thereof. |