| abstract |
(57) [Abstract] [Purpose] To develop a homogeneous photosensitive resin composition suitable for the production of printed wiring boards, which is excellent in various characteristics as a photosensitive material, particularly in plating adhesion. [Structure] A resin composition containing a photosensitive polyhydroxy ether resin as a main component, which is obtained by a reaction of a polyhydroxy ether resin and glycidyl (meth) acrylate, and having a molecular weight of 1,000 to 10 having a phenolic hydroxyl group. It is characterized by adding at least one photosensitive alkali-soluble resin obtained by introducing quinonediazides into 0000 resins. |