| abstract |
PROBLEM TO BE SOLVED: To provide a polymer suitably used for film formation, a method for producing the same, containing this polymer, capable of being fired for a short time, and having excellent heat resistance, elastic modulus and crack resistance, and Provided is a film-forming composition capable of obtaining a dielectric film. SOLUTION: A specific dihalogen compound (for example, 1, 2 -Diiodobenzene) and a specific diethynyl compound (e.g., 4,4'-diethynyldiphenyl ether) in the presence of a catalyst (e.g., a catalyst containing a transition metal compound and a basic compound) to have a specific structure Obtain a polymer. This polymer is dissolved in a solvent to obtain a film-forming composition. |