abstract |
PROBLEM TO BE SOLVED: To provide a film-forming composition which can be fired for a short time, is excellent in heat resistance, adhesion and crack resistance, and can obtain a low dielectric film, a polymer therefor and a polymer therefor. A manufacturing method is provided. SOLUTION: Certain dihalides (for example, 4,4 ') -Bis (2-iodophenoxy) benzophenone) and a specific diethynyl compound (for example, 4,4'-diethynyldiphenyl ether) are reacted in the presence of a catalyst to obtain a polymer having a specific structure. This polymer is dissolved in a solvent to obtain a film-forming composition. |