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inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_872b078d90a382c9948743dbc10b55f9
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publicationDate 2002-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002283498-A
titleOfInvention Resin molded body and molded substrate for circuit
abstract (57) [Problem] To provide a resin molded article whose surface can be coated with metal with high adhesion. The present invention relates to a resin molded article in which a surface activated by a plasma treatment is coated with a metal by a physical vapor deposition method selected from sputtering, vacuum vapor deposition, and ion plating. It is molded from a resin composition in which a rubber-like elastic body is blended with a base resin. The resin molded body contains a rubber-like elastic body having high energy absorption, which can enhance the flexibility of the resin molded body and increase the energy absorption for peeling of the metal layer. Even if an external force such as a stress caused by a difference in the coefficient of linear expansion between the metal layer and the external surface acts on the surface, the external force can be reduced and the adhesion of the metal layer can be improved. Can be done.
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