| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6c8d4dc7bd1a30d8fda907fceaeb4e69 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-10253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15747
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12041
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-486
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-52 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48 |
| filingDate |
2012-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2015-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb944b63694dc1de3d8f1105fdb321a2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_117eb0bc8d343e99cfa8eeac629dd77e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c1622b52209c5a3a3ea4e67dc8fe3b54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_82da5b658bc1f4c90ea8b11dcb38cc30 |
| publicationDate |
2015-03-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8975657-B2 |
| titleOfInvention |
Package for semiconductor light-emitting device and light-emitting device |
| abstract |
An object of the present invention is to provide a package from which a metal wiring and the like are difficult to be detached even when heat is generated from a semiconductor light-emitting element. This object is achieved with a package for a semiconductor light-emitting device comprising at least a molded resin containing (A) a SiH-containing polyorganosiloxane and (B) a filler, wherein an amount of SiH existing in the molded resin, after a heat treatment thereof at 200° C. for 10 minutes, is 20 to 65 μmol/g. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018233635-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019123248-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016172554-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10833231-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10319886-B2 |
| priorityDate |
2010-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |