| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6c8d4dc7bd1a30d8fda907fceaeb4e69 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48247
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2201-016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2933-0091
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K2003-2227
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-49107 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-52 |
| filingDate |
2010-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_117eb0bc8d343e99cfa8eeac629dd77e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f4a330e767f8d6ab5be3e8cd7a17a937
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_16431255620c4170185471a8d5e5f5b1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb944b63694dc1de3d8f1105fdb321a2 |
| publicationDate |
2012-10-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
KR-20120114290-A |
| titleOfInvention |
Material for resin molded article for semiconductor light emitting device |
| abstract |
An object of this invention is to provide the resin molded object material which can be set as the resin molded object for semiconductor light-emitting devices which improves LED output by high durability (light resistance and heat resistance) and excellent reflectance. Moreover, it is a subject to provide the resin molded object material for semiconductor light emitting devices which becomes easy to shape | mold. (A) A polyorganosiloxane, (B) white pigment, and (C) hardening catalyst, The said (B) white pigment has the following characteristics (a) and (b), The semiconductor light emission characterized by the above-mentioned. It is set as the material for resin moldings for apparatuses. (a) Aspect ratio of primary particle is 1.2 or more and 4.0 or less (b) Primary particle size is 0.1 µm or more and 2.0 µm or less |
| priorityDate |
2009-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |