| abstract |
PROBLEM TO BE SOLVED: To provide an adhesive having high adhesiveness to a substrate, free from problems such as precipitation, and exhibiting good patterning performance, and a photosensitive resin composition using the same. SOLUTION: An alkoxysilane compound represented by the following general formula (1) is produced as an additive component of a photosensitive resin composition containing a heat-resistant resin precursor. Embedded image (R 1 , R 2 , R 1 ′, R 2 ′: an alkyl group having 1 to 10 carbon atoms, m is an integer of 0 to 2. R 3 , R 3 ′: a divalent organic group, R 4 , R 4 ′: a tetravalent organic group containing an aromatic group, R 5 : A divalent organic group containing an aromatic group, n represents an integer of 1 to 50. ) |