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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-037
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
filingDate 1998-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50c05e1481593cf7a7f31bbf076799e4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd1403007a59f614e7df008013d026d9
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publicationDate 1999-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H11242338-A
titleOfInvention Positive photosensitive resin composition
abstract PROBLEM TO BE SOLVED: To provide a pattern of a high sensitivity and a high residual film ratio, a positive photosensitive resin excellent in adhesion to a sealing resin and a substrate, and an adhesion to a sealing resin. Provide excellent positive photosensitive resin. SOLUTION: 100 parts by weight of a polyamide (A) represented by the general formula (1) and a photosensitive diazoquinone compound (B) 1 to 100 parts by weight, and phenol compound (C) 1 to 30 A positive-type photosensitive resin composition comprising parts by weight and 1 to 10 parts by weight (D) of an organosilicon compound. Embedded image
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5672403-B1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008164816-A
priorityDate 1997-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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