Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-037 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G69-42 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027 |
filingDate |
1998-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_50c05e1481593cf7a7f31bbf076799e4 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dd1403007a59f614e7df008013d026d9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1512e632b2dd75442d3e4f65473c85eb |
publicationDate |
1999-09-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-H11242338-A |
titleOfInvention |
Positive photosensitive resin composition |
abstract |
PROBLEM TO BE SOLVED: To provide a pattern of a high sensitivity and a high residual film ratio, a positive photosensitive resin excellent in adhesion to a sealing resin and a substrate, and an adhesion to a sealing resin. Provide excellent positive photosensitive resin. SOLUTION: 100 parts by weight of a polyamide (A) represented by the general formula (1) and a photosensitive diazoquinone compound (B) 1 to 100 parts by weight, and phenol compound (C) 1 to 30 A positive-type photosensitive resin composition comprising parts by weight and 1 to 10 parts by weight (D) of an organosilicon compound. Embedded image |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5672403-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002212192-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2010092824-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008164816-A |
priorityDate |
1997-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |