| abstract |
(57) [Abstract] [PROBLEMS] To be excellent in moldability such as fluidity and curability, adhesiveness and solder crack resistance, and to be excellent in flame retardancy even without blending a bromine compound or antimony compound, so that it has excellent high-temperature storage characteristics. To provide an excellent epoxy resin composition for semiconductor encapsulation. SOLUTION: One or more phenol resins selected from phenol resins obtained by binding phenols and naphthols or naphthalene diols, or naphthols or naphthalene diols through a methylene group or a xylylene group, the phenol An epoxy resin composition for semiconductor encapsulation comprising, as essential components, an epoxy resin obtained by glycidyl etherification of a resin, an inorganic filler, a curing accelerator, and a cyclic phosphazene compound. |