http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016053182-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73e224665ceb7b15f8e66dfd0ee245c6 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-06 |
| filingDate | 2015-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4a4269f3148aa9d534325665b1caf0a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a120b497b746b47396ccb3be64cacda0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c0847b824150b6e82763df97a400ec9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c133738827a7cd035e657d7754353198 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8c2515895bda0139fd69203268b9fc7 |
| publicationDate | 2016-04-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2016053182-A |
| titleOfInvention | Resin composition for electronic circuit board material, prepreg, laminate and metal-clad laminate |
| abstract | An object of the present invention is to provide a resin composition for an electronic circuit board material, which has excellent moldability, has a high glass transition temperature of a cured product, and can reduce warpage when a semiconductor package is produced. The present invention relates to a resin composition for an electronic circuit board material containing (A) a phenol resin, (B) an epoxy resin, (C) an inorganic filler, and a curing catalyst. (A) contains a novolak phenol resin having a naphthalene skeleton having two or more hydroxyl groups in the molecule and at least one hydroxyl group among the hydroxyl groups. (B) contains a polyfunctional epoxy resin having two or more epoxy groups in the molecule. (A) and (B) Content of (C) with respect to 100 mass parts is 130-250 mass parts. The curing catalyst is at least one selected from the group consisting of imidazoles, amines, organic phosphines, tetra-substituted phosphonium / tetra-substituted borates, and tetraphenyl boron salts. The glass transition temperature after curing is 220 ° C. or higher. [Selection figure] None |
| priorityDate | 2015-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 59.