http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016065250-A
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_73e224665ceb7b15f8e66dfd0ee245c6 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L61-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B5-28 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 |
filingDate | 2015-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4a4269f3148aa9d534325665b1caf0a http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a120b497b746b47396ccb3be64cacda0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8c2515895bda0139fd69203268b9fc7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9c0847b824150b6e82763df97a400ec9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c133738827a7cd035e657d7754353198 |
publicationDate | 2016-04-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-2016065250-A |
titleOfInvention | Prepreg, laminate and metal-clad laminate |
abstract | An object of the present invention is to provide a resin composition for an electronic circuit board material, which has excellent moldability, has a high glass transition temperature of a cured product, and can reduce warpage when a semiconductor package is produced. The present invention relates to a prepreg comprising a base material of reinforcing fiber and a semi-cured product of a resin composition for electronic circuit board material impregnated in the base material of reinforcing fiber. The surface of the reinforcing fiber is treated with a coupling agent, and the resin composition for an electronic circuit board material contains (A) a phenol resin, (B) an epoxy resin, and (C) an inorganic filler. The component (A) contains a novolak phenol resin having a naphthalene skeleton having two or more hydroxyl groups in the molecule and at least one hydroxyl group among the hydroxyl groups. The component (B) contains a polyfunctional epoxy resin having two or more epoxy groups in the molecule. (A) And (B) Content of (C) component with respect to 100 mass parts of components is 130-250 mass parts. The glass transition temperature after curing is 220 ° C. or higher. [Selection figure] None |
isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110126430-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-110126430-A |
priorityDate | 2015-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 67.