Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b55c349b43c3ecba4977fd52cc8f8c67 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-00 |
filingDate |
2000-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f181dc31298ec8d21d45cb27212c798b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f73c4c24267354c5c06b8d409fadf421 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f7e933bb4657cb10fe4111b816e229d0 |
publicationDate |
2002-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-2002053642-A |
titleOfInvention |
Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same |
abstract |
(57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation which has not only high solder resistance but also excellent curability, can shorten molding time and reduce mold contamination. . The epoxy resin composition for semiconductor encapsulation contains the following component (A) as an epoxy resin component together with a phenol resin and an inorganic filler. (A) an epoxy resin (X) having a biphenyl skeleton and an epoxy resin (Y) having a dicyclopentadiene skeleton represented by the following general formula (1) and having an ICI viscosity at 150 ° C. of 0.4 Pa · s or more. ) And a mixed epoxy resin. Embedded image |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10331857-B4 |
priorityDate |
2000-08-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |