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publicationDate 2002-02-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2002053642-A
titleOfInvention Epoxy resin composition for semiconductor encapsulation and semiconductor device using the same
abstract (57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation which has not only high solder resistance but also excellent curability, can shorten molding time and reduce mold contamination. . The epoxy resin composition for semiconductor encapsulation contains the following component (A) as an epoxy resin component together with a phenol resin and an inorganic filler. (A) an epoxy resin (X) having a biphenyl skeleton and an epoxy resin (Y) having a dicyclopentadiene skeleton represented by the following general formula (1) and having an ICI viscosity at 150 ° C. of 0.4 Pa · s or more. ) And a mixed epoxy resin. Embedded image
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