| abstract |
(57) [Abstract] [Purpose] To provide a green epoxy resin composition for encapsulation, which has excellent moisture resistance, moisture absorption solder crack resistance, and adhesiveness, and has reduced discoloration after post-curing, and a semiconductor device using the same. . [Structure] An epoxy resin having two or more epoxy groups in one molecule, a phenol resin having two or more phenolic hydroxyl groups in one molecule as a curing agent, an inorganic filler, In a sealing epoxy resin composition obtained by adding a curing accelerator and a pigment, the epoxy resin contains a biphenyl type epoxy resin and / or a dicyclopentadiene epoxy resin, and the pigment is copper chlorinated. Phthalocyanine green is 0.05 to 1% by weight based on the total amount of the epoxy resin composition for sealing, and carbon black is 0.01 to 0.2 based on the total amount of the epoxy resin composition for sealing. % By weight. The epoxy resin composition for sealing is sealed with a cured product. |