| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K105-16 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-36 |
| filingDate |
1998-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0fc688915e4d9d3858a7e870ad357099 |
| publicationDate |
2000-06-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2000169549-A |
| titleOfInvention |
Epoxy resin composition and semiconductor device |
| abstract |
PROBLEM TO BE SOLVED: To provide a semiconductor package for surface mounting with reliability such as crack resistance at the time of solder mounting on a circuit board, moisture resistance after solder mounting, and wire sweep at the time of transfer molding. To provide a small amount of epoxy resin composition for semiconductor encapsulation. SOLUTION: An epoxy resin containing a dicyclopentadiene group having a melt viscosity at 150 ° C. of not more than 50 mPa · s represented by the formula (1), a crystalline epoxy resin, a specific phenol resin curing agent, and a fused silica powder are essential. An epoxy resin composition for semiconductor encapsulation as a component. Embedded image |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006104334-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003017631-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002053642-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4623871-B2 |
| priorityDate |
1998-12-10-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |