| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d80f1040809503e54509c871ba828f75 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02054 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76814
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6715
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02063
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31133 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-42 |
| filingDate |
1999-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_357f162becdd0ca0ee9479a013207021
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8541687be6a795047f8d6cf8bc353916 |
| publicationDate |
2001-06-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2001176855-A |
| titleOfInvention |
Substrate processing method and substrate processing apparatus |
| abstract |
[PROBLEMS] To provide a substrate processing method and a substrate processing apparatus capable of removing a resist layer and a polymer layer from an etched substrate in a short time and without complicated processing. SOLUTION: From an etched substrate W, a resist layer 3 is formed. And a substrate processing method for removing the polymer layer 5. The method includes a first step of making the surface portion 6 of the resist layer 3 and the polymer layer 5 existing on the substrate W hydrophilic, and a second step of subsequently removing the resist layer 3 and the polymer layer 6 with a treatment liquid. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20210058954-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2020129552-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2017038037-A |
| priorityDate |
1999-12-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |