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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
filingDate 1999-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7eb9187837867c9c08b7a2db9ce85446
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_51fa0ce4d4abeeaeb492059877858d89
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publicationDate 2001-06-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2001154366-A
titleOfInvention Pattern forming method using resist composition containing silicon-containing polymer
abstract (57) Abstract: A pattern forming method using a resist composition containing a silicon-containing polymer, which is excellent in O 2 -RIE resistance and enables a fine pattern to be formed by development using an alkali developing solution. . SOLUTION: A lower resist layer is formed with a first resist material, and on the lower resist layer, a general formula (1) (where R is a skeleton of a silicon-containing polymer, Ra, Rb, and Rc are each independently an alkyl group, an alkenyl Group, aryl group or general formula (2) (Wherein, Rd: divalent organic group, Re: —H, monovalent organic group or organosilyl group, Ra to Re: one or more kinds of functional groups, p, q: an integer of 1 or more, r: 0 Or forming an upper resist layer with a second resist material containing a silicon-containing polymer represented by 1), exposing the upper resist layer, baking after exposure, and developing and patterning; The lower resist layer is etched using the upper resist layer remaining by patterning as a mask.
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priorityDate 1999-12-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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