| abstract |
PROBLEM TO BE SOLVED: To provide a low soldering alloy containing zinc, which has good solderability comparable to a solder paste using a conventional tin-lead alloy solder powder and is stable for a long period of time. Provide lead or lead-free solder paste. SOLUTION: The flux for a zinc-containing solder contains an aliphatic monocarboxylic acid having a melting point of 50 ° C. or more as an activator and an organic halide having a melting point of 100 ° C. or more which does not substantially react with zinc at 50 ° C. or less. In the flux, 1 to 20% by weight of an aliphatic monocarboxylic acid having a melting point of 50 ° C or more, Melting point 1 that does not substantially react with zinc below 50 ° C The above flux wherein the organic halide having a temperature of 00 ° C or higher is contained in an amount of 0.5 to 20% by weight. Solder paste consisting of a solder powder alloy containing zinc and the above flux. The above solder paste, which is a lead-free solder alloy having a low lead content of not more than 10% by weight of lead in the solder alloy or a lead-free solder alloy containing substantially no lead in the solder alloy. |