| abstract |
A solder composition of the invention contains solder powders and a flux composition. The flux composition contains (A) a resin and (B) an activator. The (B) component contains (B1) an organic acid, and (B2) a pyridine compound represented by a formula (1) below. A chlorine concentration is 900 mass ppm or less, a bromine concentration is 900 mass ppm or less, an iodine concentration is 900 mass ppm or less and a total halogen concentration is 1500 mass ppm or less in the solder composition. n nIn the formula (1), X 1 , X 2 and X 3 are the same or different, each of X 1 , X 2 and X 3 representing a hydrogen atom, a hydroxyl group, a methyl group, an ethyl group or a propyl group, and all of X 1 , X 2 and X 3 are not simultaneously hydrogen atoms. |