| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3489
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0224
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-111 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3485
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-262
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-0244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-362
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K35-3613 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K35-363 |
| filingDate |
2005-09-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2008-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-WO2006030665-A1 |
| titleOfInvention |
Solder paste and electronic device using the same |
| abstract |
Prevents solder particle oxidation, which is a problem in soldering small-sized passive components and semiconductor integrated circuit elements with small terminal pitches, and ensures reliable solder bonding even when using a small amount of solder paste To provide a solder paste that can be made available. Specifically, it is a solder paste obtained by mixing a solder alloy powder with a flux, and the flux has a high temperature retention characteristic that covers the surface of the solder alloy powder at a preheating temperature during the heating and melting step. |
| priorityDate |
2004-09-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |