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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-312
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filingDate 1999-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f9fe86738e92f44c48d2cf5fa1a39540
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ae5ccfd65dabe84ec85ac4d083b1b602
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publicationDate 2000-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2000340557-A
titleOfInvention Insulating film forming material, insulating film forming method, and semiconductor device
abstract [PROBLEMS] To provide a material useful for forming a highly reliable insulating film having a low dielectric constant in a semiconductor device having a multilayer wiring structure. SOLUTION: A silazane-type polymer containing a repeating unit represented by the following formula (I): (Wherein, R 1 , R 2 and R 3 represent hydrogen, an alkyl group, an alkenyl group, a cycloalkyl group or an aryl group, provided that At least one is a hydrogen atom and n is a positive integer), and a silicon compound of formula (II): (Wherein, R 1 , R 2 , R 3 and R 4 represent hydrogen, an alkoxy group, a hydroxyl group or a heterocyclic hydrocarbon group, provided that at least 1 to 3 are heterocyclic hydrocarbon groups ).
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7985700-B2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7785948-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006019157-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-100785727-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007189223-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4545973-B2
priorityDate 1999-05-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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