| abstract |
A method of forming an Al 2 O 3 /SiO 2 stack comprising successively the steps of: na) providing a substrate into a reaction chamber; nb) injecting into the reaction chamber, through an ALD process, at least one silicon containing compound selected from the group consisting of:n BDEAS Bis(diethylamino)silane SiH 2 (NEt 2 ) 2 , BDMAS Bis(dimethylamino)silane SiH 2 (NMe 2 ) 2 , BEMAS Bis(ethylmethylamino)silane SiH 2 (NEtMe) 2 , DIPAS (Di-isopropylamido)silane SiH 3 (NiPr 2 ), DTBAS (Di tert-butylamido)silane SiH 3 (NtBu 2 ); nc) injecting into the reaction chamber an oxygen source selected in the list: oxygen, ozone, oxygen plasma, water, CO 2 plasma, N 2 O plasma; nd) reacting at a temperature comprised between 20°C and 400°C, preferably lower or equal to 250°C, into the reaction chamber at least one of the silicon containing compounds and the oxygen source in order to obtain the SiO 2 layer deposited onto the substrate; ne) injecting on said silicon oxide film, through an ALD process, at least one aluminum containing compound selected in the list: Al(Me) 3 , Al(Et) 3 , Al(Me) 2 (OiPr), Al(Me) 2 (NMe) 2 or Al(Me) 2 (NEt) 2 ; nf) injecting the oxygen source as defined in step c); ng) reacting at a temperature comprised between 20°C and 400°C, preferably lower or equal to 250°C, into the reaction chamber at least one of the aluminium containing compounds and the oxygen source in order to obtain the Al 2 O 3 layer deposited onto the SiO 2 layer issued of step d). |