| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2baf849d216e689ecc40ccc931a7a7bc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0387
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1039
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0757
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-037
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0233
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-037
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-075
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-023 |
| filingDate |
2002-07-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9539be7ca31514a6cab476d2cdfd99a3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_77f8ae8973a8674dc021c4facab1d8ad
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_720f9564c6000b7afdce836798b2ae94 |
| publicationDate |
2004-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-1411088-A4 |
| titleOfInvention |
POLYAMIDE ACID RESIN COMPOSITION |
| abstract |
A polyamic acid resin composition for forming a bank which comprises a polyamic acid [a] as a base and a polyamic acid [b] having a fluorine-containing alkyl group having two or more carbon atoms, and contains the polyamic acid [b] in an amount of 0.1 to 30 wt % relative to the total weight of the polyamic acid [a] and the polyamic acid [b]. The polyamic acid resin composition is excellent in coating film characteristics and adhesion to a substrate, can undergo patterning by the use of a positive photoresist, and can provide a polyimide resin exhibiting a low surface energy in the upper portion of a coating film through the conversion to a polyimide after formation of a pattern. |
| priorityDate |
2001-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |