| abstract |
A positive type photosensitive resin compositionnwhich can be developed by an aqueous alkaline solutionnand which is excellent in the developability and thenadhesion to a substrate, is presented. Namely, thenpresent invention presents a positive type photosensitivenpolyimide resin composition characterized by comprisingn100 parts by weight of a solvent-soluble polyimide havingnrepeating units represented by the formula (1) and from 1nto 50 parts by weight of a polyimide precursor havingnrepeating units represented by the formula (2), and bynfurther containing an o-quinonediazide compound in annamount of from 1 to 100 parts by weight per 100 parts bynweight of the total amount of the repeating unitsnrepresented by the formula (1) and the repeating unitsnrepresented by the formula (2):n n n(wherein R 1 and R 3 are bivalent organic groups, from 1 to n90 mol% of R 1 is a bivalent organic group having one ornplural groups of at least one type selected from thengroup consisting of a phenolic hydroxyl group, a carboxylngroup, a thiophenol group and a sulfonic group, and fromn10 to 99 mol% is a bivalent organic group having nonphenolic hydroxyl, carboxylic, thiophenol or sulfonicngroup, and R 2 and R 4 are tetravalent organic groupsnconstituting a tetracarboxylic acid or its derivative). |