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filingDate 1991-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1992-07-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0492253-A1
titleOfInvention Photolithographic process
abstract Auf ein Substrat wird eine Photoresistschicht aus einer Polymerkomponente mit funktionellen Gruppen, die zu einer Reaktion mit primären oder sekundären Aminen befähigt sind, und N-blockierten Imidgruppen, einem bei Belichtung eine Säure freisetzenden Photoinitiator und einem geeigneten Lösungsmittel aufgebracht; die Photoresistschicht wird getrocknet; die Photoresistschicht wird bildmäßig belichtet; die belichtete Photoresistschicht wird einer Temperaturbehandlung unterworfen; die derart behandelte Photoresistschicht wird mit einem wäßrig-alkalischen oder organischen Entwickler zu einer Photoresiststruktur entwickelt; die Photoresiststruktur wird mit einem ein primäres oder sekundäres Amin enthaltenden chemischen Agens behandelt; bei der Entwicklung wird dabei ein definierter Dunkelabtrag im Bereich zwischen 20 und 100 nm eingestellt.A method for structure generation in the submicron range is characterized by the following steps: A photoresist layer composed of a polymer component having functional groups which are capable of reacting with primary or secondary amines and N-blocked imide groups, an acid-releasing photoinitiator and a suitable solvent is applied to a substrate; the photoresist layer is dried; the photoresist layer is exposed imagewise; the exposed photoresist layer is subjected to a temperature treatment; the photoresist layer treated in this way is developed with an aqueous alkaline or organic developer to form a photoresist structure; the photoresist structure is treated with a chemical agent containing a primary or secondary amine; during development, a defined dark erosion is set in the range between 20 and 100 nm.
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priorityDate 1990-12-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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