| abstract |
An encapsulation (2) of an electronic device (1) is carried out by using a synthetic thermoplastic resin compound having low viscosity in a molding condition which comprises polyphenylene sulfide and a filler at a ratio of 1 : to 4:1 and a tacky or adhesive polymer at a ratio of 0.1 to 50 wt. parts per 100 wt. parts of polyphenylene sulfide by a transfer molding process or an injection molding process. |