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filingDate 1984-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9e1432a895ffbd2964b509aa757f634
publicationDate 1984-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber EP-0127369-A2
titleOfInvention Encapsulation process
abstract Electrical components, e.g. mica capacitors are encapsulated in an insulating resin. Adhesion of the resin is ensured by the provision of an intermediate pre-coat of a cured resin coating a filler and a plasticiser. Typically this precoat is an electrodeposited acrylic resin containing a barium titanate filler and a phthalate plasticiser. The encapsulating resin may be an injection moulded polyphenylene sulphide.
priorityDate 1983-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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