Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_66c37c127b4c84bee2f039e646d7a7ed |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01G2-12 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K5-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G2-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G4-224 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C1-034 |
filingDate |
1984-05-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a9e1432a895ffbd2964b509aa757f634 |
publicationDate |
1984-12-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
EP-0127369-A2 |
titleOfInvention |
Encapsulation process |
abstract |
Electrical components, e.g. mica capacitors are encapsulated in an insulating resin. Adhesion of the resin is ensured by the provision of an intermediate pre-coat of a cured resin coating a filler and a plasticiser. Typically this precoat is an electrodeposited acrylic resin containing a barium titanate filler and a phthalate plasticiser. The encapsulating resin may be an injection moulded polyphenylene sulphide. |
priorityDate |
1983-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |