| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_09fd098772dc18c1d7bddf04b97e03ed |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L81-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14655 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29K63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29L31-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C39-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B3-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L81-06 |
| filingDate |
1995-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1999-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df0005b131fd964cf09d2968765ba85a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_49fdfd93bfb4e6a5e3214dd401d04944 |
| publicationDate |
1999-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-5895620-A |
| titleOfInvention |
Process for encapsulating an electronic component |
| abstract |
Process for encapsulating an electronic component, in particular an integrated circuit, with an encapsulating material, at least comprising the steps of: placing the component to be encapsulated in a cavity of a mold; introducing the encapsulating material at elevated temperature into the cavity between the mold and the component to be encapsulated; hardening the encapsulating material; and releasing the encapsulated component from the cavity, the encapsulating material used comprising 40-65% by weight of the engineering thermoplast and 60-35% by weight of the reactive solvent. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6506328-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6302461-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9202770-B1 |
| priorityDate |
1994-12-29-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |