| abstract |
The invention provides a conductive paste composition which has low resistance, does not cause excessive shrinkage in an electrode forming process, and inhibits internal stress when an electrode is finished. The conductive paste composition contains at least (A) a binder which is a reactive oligomer having a siloxane bond as a main skeleton and containing a plurality of oxirane rings as organic groups, (B) a crosslinking agent, and (D) a conductive filler, wherein the epoxy monomer contains oxirane rings, and the sum of (A) to (D) is 100 parts by weight, and the weight of (A), (B), (C), and (D) is within a specific range. |