| abstract |
(57) [Summary] [Structure] (A) Silver powder, (B) Epoxy resin that is liquid at room temperature, (C) Diallylbisphenol A and 1,1,3,3 A conductive resin paste containing a reaction product obtained by hydrosilylation reaction of tetramethyldisiloxane as an essential component, and (A) in the entire conductive resin paste. 60 to 85% by weight of component, 1 to 20% by weight of component (C) Conductive resin paste containing. [Effect] The elastic modulus of the cured product is low, which is suitable for bonding large chips to a copper frame, and is highly reliable because it can prevent characteristic defects based on the difference in the coefficient of thermal expansion between the copper frame and the silicon chip. It is a conductive resin paste for bonding semiconductor elements. |