| abstract |
A substrate processing apparatus and a substrate processing method, which perform a plasma process by carrying a substrate holder holding a plurality of substrates in a shelf shape into a vertical processing container, wherein the substrate is processed with high uniformity in the surface of each substrate. The substrate processing apparatus includes: a protrusion (41) that forms a longitudinal space that communicates with a processing space (13) for accommodating the substrate holder (3) and performing processing, in such a manner that a side peripheral wall of the processing container (11) bulges outward; a gas discharge unit (62) provided in the longitudinal space and configured to discharge a process gas into the process space; and an antenna (42) which is provided in the longitudinal direction at the convex portion and which is supplied with high-frequency power to turn the process gas into plasma in the longitudinal space. The apparatus further includes shields (7) extending laterally from the antenna to the processing space at the projections, respectively, for shielding an electric field generated by the antenna to suppress plasma from being generated in the processing space. |