http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-105773398-A

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filingDate 2006-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2016-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-105773398-A
titleOfInvention Apparatus and method for spectrum based monitoring of chemical mechanical polishing
abstract The invention discloses an apparatus and method for spectrum based monitoring of chemical mechanical polishing. Apparatus and methods for spectrum based monitoring include spectrum based endpointing, spectrum based polishing rate adjustment, flushing a top surface of an optical head, or a pad with a window. The spectrum-based endpointing uses a reference spectrum which is empirically selected for particular spectrum based endpoint determination logic so that a target thickness is achieved when an endpoint is called by applying the particular spectrum based endpoint logic. The polishing endpoint can be determined using a difference trace or a series of sequences. A flushing system creates a laminar gas flow across the top surface of the optical head. A vacuum nozzle and vacuum sources are configured such that the flow of gas is laminar. The window includes a soft plastic portion and a crystalline or vitreous portion. The spectrum based polishing rate adjustment includes obtaining spectra for different zones on a substrate.
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