http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113478382-B

Outgoing Links

Predicate Object
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B24B37-04
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-20
filingDate 2021-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2022-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2022-11-04-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-113478382-B
titleOfInvention Inspection windows, chemical mechanical polishing pads and polishing systems
abstract The invention discloses a detection window, a chemical mechanical polishing pad and a polishing system related to the technical field of chemical mechanical polishing. The detection window of the present invention is arranged in the polishing layer, and includes a light-transmitting portion and a reinforcing portion. The lower surface of the light-transmitting portion is provided with a concave area, the reinforcing portion is located in the concave area, and the reinforcing portion and the light-transmitting portion are integrally formed or bonded together. A hollowed-out part is arranged in the part, 0<the cross-sectional area of the hollowed-out part≤80% of the cross-sectional area of the concave region; further, the hollowed-out part in the middle of the reinforcing part and/or the hollowed-out edge is preferably a hollowed-out and disconnected reinforcing part in the middle of the reinforcing part Center cutout and edge cutout. The detection window provided by the invention has improved window strength and reduced compression ratio, which can effectively reduce wafer scratches and improve the service life of the polishing pad.
priorityDate 2021-07-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 43.