| abstract |
The invention discloses a succinimide silver plating solution and an electroplating method. The succinimide silver plating solution comprises the following components: 10-20g/L silver nitrate and 130-150g/L succinimide by referring silver content, 30-40g/L methylsulfonate by referring methanesulfonic acid radical, 20-30g/L carbonate and 1-2g/L polyethyleneimine by referring carbonate radical. According to the invention, succinimide is taken as a coordination agent, methylsulfonate is selected as an additive for increasing compactness and smoothness of a plating layer, polyethyleneimine is taken as a brightener, so that the plating liquid has good stability, and the plating layer has discolouration resistance and strong weldability. |