http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-106567109-B

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-46
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-46
filingDate 2016-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2021-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2021-04-09-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber CN-106567109-B
titleOfInvention Cyanide-free silver plating electroplating solution and electroplating method thereof
abstract According to the cyanide-free silver electroplating solution and the electroplating method provided by the invention, the silver methylsulfonate is used as the silver plating main salt, the carbene silver sulfonate is used as the complexing agent, and other additive components are compounded and synergized, the cyanide-free silver electroplating solution does not contain cyanide, is harmless to the environment and human body, and has a reasonable formula and good solution stability; the pulse electroplating is used during electroplating, so that the problems of large stress and brittleness, poor bonding force and the like of a coating are effectively solved, the coating with good bonding property with a substrate, small coating stress, good compactness and brightness is obtained, and the obtained silver coating is suitable for application of a reflecting layer, a high conducting layer and a brazing coating in the fields of photoelectricity and microelectronics, and the sensitivity of signal acquisition can be greatly improved.
priorityDate 2016-11-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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