http://rdf.ncbi.nlm.nih.gov/pubchem/reference/34064795

Outgoing Links

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contentType Journal Article|Review
issn 1521-4095
0935-9648
issueIdentifier 52
pageRange e2201023-
publicationName Advanced materials (Deerfield Beach, Fla.)
startingPage e2201023
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bibliographicCitation Wen Y, Chen C, Ye Y, Xue Z, Liu H, Zhou X, Zhang Y, Li D, Xie X, Mai Y. Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review (Adv. Mater. 52/2022). Advanced Materials. 2022 Dec;34(52). doi: 10.1002/adma.202270358.
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date 2022-09-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
identifier https://doi.org/10.1002/adma.202201023
https://doi.org/10.1002/adma.202270358
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language English
source https://www.crossref.org/
https://pubmed.ncbi.nlm.nih.gov/
title Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review (Adv. Mater. 52/2022)

Total number of triples: 31.