reference/204282343

Predicate	Object
contentType	Journal Article
issn	0947-8396 1432-0630
issueIdentifier	12
pageRange	849-
publicationName	Applied Physics A
startingPage	849
bibliographicCitation	Yang L, Wang G, Zhang Y, Xiong Y, Jiang W. Influence of tungsten carbide (WC) nanoparticle on microstructure and mechanical properties of Cu/Sn57.6Bi0.4Ag/Cu solder joints. Applied Physics A. 2018 Nov 28;124(12):849. doi: 10.1007/s00339-018-2255-4.
creator	http://rdf.ncbi.nlm.nih.gov/pubchem/author/MD5_e2eace06d2e9d594b837cf0875201da5 http://rdf.ncbi.nlm.nih.gov/pubchem/author/MD5_741734cd7dc29bb1028a5f74caeee1c9 http://rdf.ncbi.nlm.nih.gov/pubchem/author/MD5_86d486728c3262d660d69e96577b27d2 http://rdf.ncbi.nlm.nih.gov/pubchem/author/ORCID_0000-0002-0151-0526 http://rdf.ncbi.nlm.nih.gov/pubchem/author/MD5_60314c9376bf62fdc9cbd67dda6da1df
date	2018-11-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
identifier	https://doi.org/10.1007/s00339-018-2255-4
isPartOf	http://rdf.ncbi.nlm.nih.gov/pubchem/journal/38289 https://portal.issn.org/resource/ISSN/1432-0630 https://portal.issn.org/resource/ISSN/0947-8396
language	English
source	https://www.crossref.org/ https://scigraph.springernature.com/
title	Influence of tungsten carbide (WC) nanoparticle on microstructure and mechanical properties of Cu/Sn57.6Bi0.4Ag/Cu solder joints

Total number of triples: 22.