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filingDate 1999-05-19-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_33481e406e97c297111294ccd977f9e4
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publicationDate 1999-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-9960621-A1
titleOfInvention Method and apparatus for treating a semi-conductor substrate
abstract There is disclosed a method of treating a semi-conductor substrate comprising the steps of: (a) depositing on the substrate a polymer layer; and (b) heating the substrate in the absence of oxygen prior to the deposition of any further layer to substantially remove O-H bonds from the polymer and substantially cure the layer. A silicon-containing compound and a compound containing peroxide bonding may be introduced into the chamber. Also disclosed is an apparatus for implementing the method.
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priorityDate 1998-05-21-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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