http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9914790-A1

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filingDate 1998-09-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7c288d7a92404fc88233991924196b87
publicationDate 1999-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-9914790-A1
titleOfInvention Resistive heating of power coil to reduce transient heating/start up effects
abstract A method and apparatus for preheating a coil used to generate a plasma field in a processing chamber in a semiconductor fabrication system. The coil is preheated in the chamber prior to sputter depositing material onto a substrate and workpiece. The coil is preheated to a predetermined temperature, which is preferably equal to or greater than the equilibrium temperature attained by the coil during sputter deposition processes. Preheating may be effected with a preheating current having a frequency lower than the minimum frequency required to ignite a plasma, or when the processing chamber contains an atmosphere which prevents formation of a plasma. The coil may preheated for a predetermined time period.
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priorityDate 1997-09-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 30.