| abstract |
The invention relates to thermoplastic moulding materials containing A) 30-98 wt.% of a thermoplastic polymer comprising, in relation to A), a1) 50-100 wt.% of a styrene compound of general formula (I), in which R<1> and R<2> stand for hydrogen or C1-C8-alkyl, or of a (C1-C8 alkyl) ester of acrylic acid or of methacrylic acid, or mixtures of the styrene compounds and the (C1-C8-alkyl) ester of acrylic acid or methacrylic acid, a2) 0-40 wt.% acrylonitrile or methacrylonitrile or their mixtures, and a3) 0-40 wt.% of one or several other monoethylene unsaturated monomers that are different from a2), B) 1-69 wt.% of a first particle-shaped rubber-elastic polymer B) with a particle diameter d50 of average weight of 300 nm or less, C) 1-69 wt.% of a second particle-shaped rubber-elastic polymer C) with an average-volume particle diameter d50 between 700 nm and 100 mu m, whereby the polymer C) is obtainable by the microsuspension polymerization method, by i) dispersion of the monomers corresponding to the polymer C) in water using at least one protective colloid to form a dispersion of droplets with an average-volume particle diameter d50 between 700 nm and 100 mu m, and (ii) polymerization of the droplets by means of a radical polymerization initiator, and D) 0-80 wt.% of one or several other polymers. |