| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_be055db3c1a09879df07379ba969e223
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1eeedde41a3131f4af0796abcec6bd67
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c85121fe17f32593a907c37a47ffb7ad
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_baa955465a00feb73e4e6d54a1567aed |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49146 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-565
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-284
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C70-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14836
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14639
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3135 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29L31-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C70-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-00 |
| filingDate |
1996-12-06-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8bcd25a4ac583b00b9788b5221da2730
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9dbdb70f28f6b41972568d2b9050c0c1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_041ef879132ea7d4c219ff2af1ea8f72 |
| publicationDate |
1997-06-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-9720673-A1 |
| titleOfInvention |
Process for manufacturing resin-encapsulated electronic product |
| abstract |
A method of manufacturing a small electronic component with an improved yield. The method comprises the mounting step of mounting required electronic components (2-4) on a printed wiring board (1) by soldering, the coating layer forming step of forming a coating layer (14) which encapsulates the whole of the printed wiring board (1) including the electronic components (2-4) with a coating material having a superior heat resistance, and the package layer forming step for forming a package layer (17) which encapsulates the coating layer (14) with a thermoplastic resin material. In the package layer forming step, the coating layer (14) restrains the heat of the thermoplastic resin material from affecting the electronic components (2-4), the printed wiring board (1) and the like. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0986111-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0986111-A2 |
| priorityDate |
1995-12-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |