| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_afea2aa6f1f892c1456cf7d7a8bc0242 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29L31-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C45-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 |
| filingDate |
1992-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_aa9587c02c81d06036af9b15606943b7 |
| publicationDate |
1994-07-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H06198669-A |
| titleOfInvention |
Resin encapsulation method for electronic parts |
| abstract |
(57) [Abstract] [Purpose] The resin of an electronic component is less likely to be adversely affected by the sealing of the electric element itself or the bonding member or the locking member that constitutes the electric element during the resin sealing. A sealing method is provided. An electronic component characterized in that, when the electronic component is resin-sealed by an injection molding method using a thermotropic liquid crystal polymer, the heat resistance of the electronic component is at least 5 ° C. higher than a mold temperature in the injection molding. Resin encapsulation method. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-5672303-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9153372-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H09289849-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6008681-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9720673-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2013001592-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6052893-A |
| priorityDate |
1992-12-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |