Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9ee12a05c7bf51327bc4b4f54e10bc88 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F2998-00 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F1-103 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F3-1025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F3-225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-17 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B22F1-10 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F1-103 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F1-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F3-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B22F3-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-17 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-20 |
filingDate |
1995-11-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5139c531b1249769f69a8ed335e8a144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8023d23164f7b7dae34c2a4643105010 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_478cbcef225227801d90e2fd5867c915 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_73e29cd674469dd633abb621c2766cd1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5cd46d32aba6186c9d1aae9bdfdbebd2 |
publicationDate |
1996-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-9625261-A1 |
titleOfInvention |
Binder for use in metal powder injection molding and debinding method by the use of the same |
abstract |
By the use of a binder comprising: a) 40 to 70 wt.% of a water-soluble amide material and/or water-soluble amine material and b) 25 to 60 wt.% of a polyamide resin component substantially composed of a polyamide resin material having 10 carbon atoms or more on average between amido groups, a molded article is produced by metal powder injection molding. From such a molded article, the water-soluble amide material and/or water-soluble amine material is eluted by a water-based solvent and then, the polyamide resin component is removed by heating. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2199344-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2006031193-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-113195592-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-19782035-C2 |
priorityDate |
1995-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |