| abstract |
An electronic packaging module (100) for inverted bonding of semiconductor devices, integrated circuits and/or application specific integrated circuits (140), is produced with metal protuberances (130) on the conductive pattern of the substrate (110). The metal protuberances (130) are manufactured from a soft ductile metal capable of metallurgically bonding to the input/output connections (341) of semiconductor devices. The input/output connections (341) of the semiconductor devices are simultaneously bonded to the metal protuberances (130) of the electronic packaging module (100). |