| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15312
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09845
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0557
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-115
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-096
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4667
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5383
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-486 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538 |
| filingDate |
1985-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_67b13d1d6daee01ade90577c0721bfaa
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5aeeaa6b7defcaa18144de5750eb94c7 |
| publicationDate |
1985-12-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
EP-0165575-A2 |
| titleOfInvention |
Method for forming vias in a planar structure |
| abstract |
A method for forming vias in a planar structure is described. In the fabrication of an interconnection package for a plurality of semiconductor or integrated circuit chips (24) a multi-layered glass superstructure (30) with a multi-layered distribution of planar conductors (48) is formed by a process forming vertical conductive interconnection or studs (54) between planar conductor layers (48) by pre-forming a stepped-shoulder or counter-bored via configuration in each glass-layer (50) at the interconnection points followed by depositing the conductive studs therein. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5866441-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5904499-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7999192-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5599413-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2229042-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6165820-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/GB-2229042-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2011032838-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6181219-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5627406-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8952259-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0599595-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-0599595-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5793105-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9619829-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6614110-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102550136-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102550136-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9820530-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8481866-B2 |
| priorityDate |
1984-06-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |