http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-9526567-A1
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a2aeba43be164863b9265336f1681ee3 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S148-012 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01P15-0802 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P15-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L49-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01P15-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01D21-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-306 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-84 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B81C1-00 |
| filingDate | 1995-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b1b159b631520dde61e9f7c7d6218434 |
| publicationDate | 1995-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | WO-9526567-A1 |
| titleOfInvention | Method for fabricating suspension members for micromachined sensors |
| abstract | A method for fabricating a connecting spring member (24) of an arbitrary shape extending between a central mass (21) and an outer support frame (23) of a sensor as shown in Figure 7 is disclosed. Each of a pair of generally identical silicon wafers (10, 12) has an inner etch stop layer (16) applied to one face with an outer epitaxial layer (18) formed over such etch stop layer (16). A photosensitive oxide layer (30) is applied to the other face of each of the wafers (10, 12). Next, a pattern of the central mass (21) and outer support frame (23) as shown in Figure 2 is photographically imposed on the photosensitive oxide layers (18) of each wafer (10, 12). After wet chemical etching of the wafers (10, 12) removes silicon material to the etch stop layer, and the etch stop layer is itself removed in the space between the mass and the frame, the two wafers (10, 12) are bonded to each other as shown in Figure 5. Next, the spring shape, of any arbitrary shape is formed by plasma etching from the outer surfaces of the bonded wafers (10, 12) in the area between the mass and the frame. Accordingly the spring members (24) extend between the central mass (21) and the outer support frame (23). |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-0224570-A1 |
| priorityDate | 1994-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 28.