Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F22-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-3415 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-027 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F22-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F2-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-3415 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-027 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
filingDate |
2022-06-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_864e83db436c3f517692d537915ca732 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71445ff84898d863cbe787bb75fe7aac http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_77b2ac7ebd2f60e976a1b98952358495 |
publicationDate |
2022-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
WO-2022264985-A1 |
titleOfInvention |
Resin composition, resin sheet, multilayer printed wiring board and semiconductor device |
abstract |
The present invention provides: a resin composition which does not inhibit a photocuring reaction in a light exposure step if used for the production of a multilayer printed wiring board, while exhibiting excellent photocurability with respect to various active energy rays, and which is capable of providing excellent alkali developability in a development step, while enabling the achievement of an insulating layer that exhibits excellent adhesion to an adhesive metal such as titanium; a resin sheet; a multilayer printed wiring board; and a semiconductor device. A resin composition according to the present invention comprises: (A) a bismaleimide compound which contains a constituent unit represented by formula (1) and maleimide groups at both ends of the molecular chain; and (B) an imidazole compound represented by formula (2). |
priorityDate |
2021-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |