| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_696ca0ae93d5cf5a686273601361781f |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-287 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0346
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F234-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0298
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-126
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08F2-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-092
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-085
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-53 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-53
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-101
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L45-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08F234-00 |
| filingDate |
2020-12-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_71445ff84898d863cbe787bb75fe7aac
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_864e83db436c3f517692d537915ca732
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d23bbea45aa676bf05607b9d5afbf256
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_77b2ac7ebd2f60e976a1b98952358495 |
| publicationDate |
2021-06-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2021117762-A1 |
| titleOfInvention |
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device |
| abstract |
The present invention provides: a resin composition which has good solubility and photocurability, while additionally having good alkali developability in cases where a photopolymerization initiator and a compound having one or more carboxyl groups are contained therein, and which enables the achievement of a resin sheet that is suppressed in tack properties; a resin sheet which uses this resin composition; a multilayer printed wiring board; and a semiconductor device. A resin composition according to the present invention contains a specific bismaleimide compound (A) and at least two kinds of maleimide compounds (B) that are different from the bismaleimide compound (A), while being selected from the group consisting of six kinds of specific compounds. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022264984-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2022264985-A1 |
| priorityDate |
2019-12-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |